High-Performance Active Cooling Kit
A reinforced aluminum chassis combined with copper heat-pipe heatsink and a PWM industrial fan for AGX Orin class modules. Designed for mobile robots, outdoor vision and higher ambient temperature environments.
Active · ODM
High-Performance Active Cooling Kit
$350 – $600
A reinforced aluminum chassis combined with copper heat-pipe heatsink and a PWM industrial fan for AGX Orin class modules. Designed for mobile robots, outdoor vision and higher ambient temperature environments.
- Copper heat pipes: High thermal conductivity to move heat fast
- PWM industrial fan: Speed controlled, EMC shielded
- Shock-resistant: Robust mounting for mobile platforms
10 pcsMOQ
5–8 working daysSample lead
15–22 daysMass production
Compatibility: This product is designed to be compatible with the Jetson AGX Orin (32/64GB). Jeviwis does not sell NVIDIA modules and is not affiliated with or endorsed by NVIDIA.
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Specifications
Technical Specifications
Reference parameters for the standard model. All values are customizable through ODM.
| Parameter | Value |
|---|---|
| Compatible Module | Jetson AGX Orin (32/64GB) |
| Material | Aluminum + copper heat pipes |
| Cooling | Active PWM fan, EMC shielding |
| Protection | IP30, shock-resistant mounting |
| Working Temp | -25°C ~ +65°C |
| Custom Service | IO windows, bracket, finishing ODM |
| Compliance | CE, ISO9001, RoHS |
| Sample Lead Time | 5–8 working days |
| MOQ | 10 units |
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